Thermal Management of High Heat Dissipating Electronic Components: LED Module and Metal Diodes

Abstract

Every day, new electronic products such as COB LED lighting products, inverters, metal diodes/rectifier module etc are launched in the market worldwide. Many of these LED lighting products and high power metal diodes (in the form of rectifier module) come either without any cooling provision or with low grade cooling provision. Aluminum heat sinks are the most common thermal management hardware solution in use for majority LED Modules as well as for Metal Diode Rectifier Module. The goal of the work performed and explained in this manuscript under the title “thermal management of high heat dissipating electronic components: led module and metal diodes” is to first observe and analyze the extent to which thermal management is achieved by existing Aluminum hardware on a selected LED Module and on Metal Diode Setups and then developing a new hardware using copper material for the selected LED Module and Metal Diode which will provide an enhanced thermal management than the existing aluminum hardware solution.