Advancement in Soldering Technology Main Issues and Its Perspectives – Part III

Abstract

Scientific and systematic study has lead to an increased knowledge of variety of materials and their different properties. For the development of semiconductor materials, nano technology has played a significant role. This has made it possible to offer tremendous innovation in semiconductor industry. The present paper discuss about a latest and novel soldering techniques using reballing process known as BGA & CGA technique. Also, requirement and selection criteria of different components used for this process and its applications are discussed.