HUSSEIN, R. Analytic Simulations of Packaging Cardboards with Non-Rigid Adhesives. International Journal on Recent and Innovation Trends in Computing and Communication, [S. l.], v. 7, n. 6, p. 01–15, 2019. DOI: 10.17762/ijritcc.v7i6.5311. Disponível em: https://ijritcc.org/index.php/ijritcc/article/view/5311. Acesso em: 27 nov. 2021.