, P. R. B. S. Thermal Management of High Heat Dissipating Electronic Components: LED Module and Metal Diodes. International Journal on Recent and Innovation Trends in Computing and Communication, [S. l.], v. 3, n. 11, p. 6075–6089, 2015. DOI: 10.17762/ijritcc.v3i11.4993. Disponível em: https://ijritcc.org/index.php/ijritcc/article/view/4993. Acesso em: 27 jul. 2024.